Global Sales of Memories

Global Sales of Memories Will Be Higher This Year

Sales will continue to grow until next year
Increased production of DRAM for HBM and servers is drawing attention

An analysis suggests that the ‘semiconductor supercycle’ driven by artificial intelligence (AI) will fundamentally change the structure of the memory semiconductor market. Amid a memory shortage that is already happening in the market, the global memory market is expected to exceed USD 500 billion this year, more than doubling last year’s size.

According to Taiwanese market research firm TrendForce, global sales of memories will reach USD 551.6 billion (approximately KRW 795 trillion) this year, a 134% increase from last year. It also analyzed that sales in 2027 will peak at USD 842.7 billion (approximately KRW 1,215 trillion), a 53% increase from this year.
This growth is driven by the AI industry’s development direction because the need for high-bandwidth, large-capacity DRAMs for large-scale model parameter processing, inference, and multi-task parallel processing is growing as the data covered is exploding in quantity.
The fact that major suppliers such as Samsung Electronics, SK Nynix and Micron are adopting the ‘selection and concentration’ strategy is also affecting the market. As these companies focus on expanding their production of DRAMs for high-bandwidth memory (HBM) and servers due to the increase in demand for HBMs, which are considered ‘a leader’ in the AI semiconductor field, market prices for general-purpose DRAMs supplied to sets such as smartphones or PCs are soaring due to lack of supply.
The automobile industry is also faced with hardship due to an increase in vehicle DRAM prices. In the automobile industry, older model DRAMs are primarily used since it takes more than two years to verify the reliability of parts.
However, there is a high possibility that the manufacturing of these products will decrease as memory suppliers rapidly change their lines to the latest process for AI, which are more profitable.

 
 
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