Samsung Elec Pledges $116bn CAPEX in Korea over the Next Three Years Group’s flagship Samsung Electronics on Wednesday pledged 180 trillion won ($160.7 billion) in capital expenditure – including 130 trillion won in Korea – in its mainstay semiconductor operation as well as new growths of artificial intelligence, automated and connected technologies, and bioengineering over the next three years to help create 700,000 jobs.
The ambitious plan including direct hiring of 40,000 comes as facility investment this year has been in the longest slump in 18 years while job additions are at their worst in a decade to prompt the liberal government known to be hostile toward chaebols to ask for more hiring and investment from the country’s richest and one of the world’s biggest technology companies.
“We have decided to boost new investment and hiring to help revitalize the economy and promote new industries,” the company said in a statement.
Of the total investment, 72 percent or 130 trillion won will be spent in the country, which will have the effect of creating up to 700,000 new jobs.
The spending would amount to 43 trillion won annually, about the same level of Samsung Electronics’ record 43.4 trillion won spending last year – which was the largest-ever annual spending for any publicly trading company in 2017 – after finishing its best-ever year due to the memory chip boom.

The bulk will go to uphold its competitive edge in chips and displays. About 25 trillion won will be spent on new growth areas of artificial intelligence, 5G connection, biopharmaceutical, and automotive electronics.
It will increase payroll by 40,000 over the next three years, nearly doubling from the original plan of 20,000 to 25,000.
The company also pledged to help create a socalled innovative ecosystem by sharing innovative capacity through training opportunities to 10,000 young job seekers over the next five years. It will sponsor 500 venture projects.
Samsung also plans to create a 110 billion won fund with the Ministry of SMEs and Startups over the next five years to help transform manufacturing facilities of 2,500 small and mid-size companies into smart ones and help them advance into other markets at home and abroad. This plan will help create about 15,000 new jobs. | Blog Magazine of korean electronics, brands and Goods

Samsung Elec Unveils World’s LargestCapacity V-NAND Chip and New SSD world’s largest memory chip maker Samsung Electronics Co. unveiled its new Vertical NAND (V-NAND) flash memory with the world’s biggest storage capacity of 1-Terabit (Tb) along with next-generation solid state drive (SSD) solutions.

At the Flash Memory Summit 2017 recently held at the Santa Clara (CA) Convention Center, Samsung Electronics presented its new 1-Tb V-NAND chip.

V-NAND is the flash memory technology used in data storage devices including mobile phones and digital cameras. The V-NAND in a stacked structure can provide higher single-die density than those with 2-dimensional (2D) cellarrays, and demand for it is growing rapidly along with rising applications of artificial intelligence and Internet of Things (IoT).

The company said in a statement that with the new 1-Tb V-NAND chip that boasts twice larger storage capacity than the existing 512-Gigabit (Gb) chip, it is possible to construct2-Terabyte (TB) memory in a single V-NAND package by stacking 16 1Tb dies.

Considering that 1 Tb is equal to 128 GB, and a typical two-hour-long HD movie takes up 1.5 to 2 GB of memory capacity, about 60 to 70 movies can be stored in a single V-NAND chip.



Samsung aims to introduce the world’s largest-capacity SSD applying 1-Tb V-NAND memory technology next year. At the summit, Samsung Electronics also presented its new SSD technology, dubbed Next Generation Small Form Factor (NGSFF) SSD, which is expected to dramatically improve the memory storage capacity. With the new NGSFF SSD, four times larger memory storage capacity can be secured in the same server, so data centers and customers using the server can build more efficient system, according to Samsung, said Samsung. The company plans to begin mass producing it in the fourth quarter of this year.

An SSD is a storage device that can replace a hard disk drive (HDD). It uses high-speed memory semiconductors such as NAND flash memory or dynamic random access memory (DRAM) chips for storage that ensure high processing speed, low heating and little noise.

<Source : KITA> | Blog Magazine of korean electronics, brands and Goods

Samsung Display Unveils 65-inch, Next-Generation Curved Display LCD Korea’s Samsung Display Co. recently unveiled nextgeneration curved panels in liquid crystal display (LCD), pushing the rigid display technology to a new level as it has been quickly losing appeal against flexible OLED.

The company presented its 65-inch S-Curved LCD and 65-inch Curved Glass Light Guide Plate (LGP) at the 2nd Curved Forum held at the Yanqi Lake International Convention Center in Beijing, China.

The 65-inch S-Curved LCD is a next-generation display that bends all four sides including above and below. The center of the screen looks as if it is slightly dented, which the company says provides a more vivid viewing experience. The 65-inch curved glass LGP has also applied next-generation technology as it has an edge thickness of only 4.9 millimeters.

A spokesperson for Samsung Display said that a display product that is curved on both sides has already been commercialized in the market but it is the first type in LCD.



The 65-inch curved glass LGP with an edge thickness of 4.9 millimeters also provides improved light transmittance and thinner display as it replaces plastic light guide panel component that evenly disperses light within LCD with glass.

The spokesperson said that applying glass LGP to televisions provides improved image quality and also more flexible design for living space interior. Samsung Display, meanwhile, plans to enhance its partnership with major TV manufacturers including TCL Corporation and Hisense Co. in China, the world’s largest premium TV market, to boost the overall curved display market. The company is betting on curved products as core technology that will lead to new solutions in the LCD market that has shown sluggish growth recently.

<Source : KITA> | Blog Magazine of korean electronics, brands and Goods

Samsung to unveil super-slim smartphone ‘Galaxy Alpha’

Samsung Electronics is scheduled to release a new slimmer smartphone featuring a metal case for the first time in the world. The global tech giant recently said it will unveil the “Galaxy Alpha” smartphone sequentially in about 150 countries from this month.

Galaxy-Alpha The smartphone features a whole array of the Galaxy series’ latest functions such as 4.7-inch HD Super-AMOLED display, finger print recognition, S Health and Ultra Power-Saving Mode.

The new smartphone’s boasts reduced thickness to 6.7 millimeters (mm) by covering the device with a metal case. This is far slimmer than the 8.1 mm-thick “Galaxy S5’’ and the rival company’s 7.6 mm-thick “iPhone 5S.” An official at the Samsung Electronics recently said, “We focused on maximizing the in-hand grip.” The industry believes the tech behemoth has entered the race of the thickness of smartphones, a global trend, with the Galaxy Alpha. | Blog Magazine of korean electronics, brands and Goods

Samsung Mass-Produces DDR4 Modules


Samsung Electronics will open a new era for DRAM memory for PCs and enterprise server systems in the second half of this year. The next generation of DRAM memory has begun as South Korea-based electronics giant initiated the world’s first mass-production of ultra-thin mobile memory chips based on 20-nanometer-level technology.

Samsung Electronics recently announced that it will be mass-producing 20 nano-level 16 GB (Gigabyte) and 32GB DDR4 RAM modules for enterprise servers in next-generation data centers. The new DDR4 memory is highlighted by a 1.25-fold increase in data transmission rate and 30 percent cut in power consumption compared to the existing 20nm-class DDR3. This means the new memory will speed up a computer’s boot time. Samsung is confident that its modules support up to 2,667Mbps transfer speeds. The process of replacing DDR3 into DDR4 will begin in the second half of this year, enhancing performance and lowering power consumption.


By Kim Min-su : Here