Semiconductor equipment

MIS was founded in 2004 with the specialized knowledge of decapsulation technology for semiconductor failure analysis. MIS has been putt ing its focus on the development of the equipment ensuring prompt and precise work performance. As a result of the eff orts, now MIS can guarantee safety in working for those who use the equipment, and further, it can bring about an improvement in working effi ciency and a remarkable reduction in production costs to customers.

https://korean-electronics.com//inquiry The company’s laser decaper is used to remove the EMC package of semiconductor chips using laser in order to inspect the inner part, so that it helps failure analysis of semiconductor chips. All the functions can be activated by keyboard and mouse.

And also, the maker’s wet etch is a key product of the company, which is designed to be used for removing the EMC package of semiconductor chips using a chemical method in order to inspect the inner part, so that it helps failure analysis of semiconductor chips. All the functions shall be activated by control panel, so the user can fi nish the work safely without using gloves or mask, etc. The main features include fast, dual heating process (Jig plate heating& IR beam heating, accurate decapsulation (chemical etchant dispensing volume: minimum 0.005ml, safe operation (decapping in chamber), no need for consumable gaskets, and repetitions made simple using recipe fi les.

Semiconductor-equipment

 
 
korean-electronics.com | Blog Magazine of korean electronics, brands and Goods

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