Conductive materials for direct nano-patterning

Technology overview: Ag and Cu nano-particle and nano-ink were key subjects of development as materials to form fine patterns through more improved methods than the classic photolithography process. products were developed to satisfy functional performances, such as nano-particles that have shape and dispersion properties suitable to direct patterning and electrical conductivity; and that satisfies process performances such as flow characteristics of ink, low temperature sintering process for the densification of pattern, conjugational property with substrate, and patterning resolution. For flexible electronics field which is highlighted as a future promising business, a technology that can realize a pattern on ductile substrate is essential, and direct patterning technology has great competitiveness as it is assessed as having the most competitive power in this field. Developed nano-ink provides a technical base to apply new processes from applications such as FPCB, Touch Screen Panel, Solar Cell, RFID, TFT to energy and bio, future promising industrial fields by utilizing various printing techniques including the adjustment of material (Ag) content, solvents, and additives, EHD (Electrohyrodynamic), ink-jet printing, gravure offset printing, and screen printing.

Industrialization: The technical area of direct nano-patterning covers various industrial areas including semiconductor, energy, bio, and display, and relevant application market is expected to grow up to 25 trillion won by 2025, therefore, the development of its core base technology which is direct nano-patterning is meaningful from an industrial economic perspective. Aided by such trends, the process technology established by AmogreenTech is an eco-friendly technology with mass productivity and considered as a more economically feasible nano-particle production process. Currently, a process was developed for economical feasibility in producing less than 20nm circular Ag nano-particles, and Nano-ink using that process allows EHD jetting within 1~1500cP of broad viscosity range and can realize patterns with 5B of adhesive strength.
The specific resistance of pattern manufactured with the produced Ag nano-ink shows low specific resistance as 4.48 uΩcm (for 200℃) or 9.11 uΩcm (for 130℃), and recently lower specific resistance like 3~4 uΩcm (Ag nano-ink), or 10 uΩcm or less (Cu nano-ink) is possible by applying optical sintering technology, thus there are active reviews on the applications that request lower resistance.

Problem-solving in industrialization: As demand for applying printed electronic technology is rapidly expanding in application fields like flexible substrate and large area touch screen, there have been persistent attempts to develop an ink that allows lower temperature sintering in foreign countries, but lower specific resistance, and improvements of adhesive strength and reliability are required. Also, utilizing wiring patterned with existing conductive ink is limited due to limitation to substrate materials, because the line width is around 50㎛, the specific resistance shows considerably high value compared to pure metal, and the heat treatment temperature to get appropriate adhesive strength with substrate is as high as hundreds degree.
In addition, there are research attempts on conductive materials utilizing Au or Ni, but their practical value is very limited due to pricing issue and high heat treatment temperature. Therefore, a technical team in AmogreenTech developed nano-particle manufacturing technology that allows plasticity in low temperature using Ag and Cu as conductive materials, and ink manufacturing technology that can enhance conductivity and adhesive power to overcome the limitation of substrate material and utilization. | Blog Magazine of korean electronics, brands and Goods

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